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    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Description: “..., the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations...”
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  • 2
    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Description: “..., the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations...”
    Saved in:
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