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    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Descripción: “... of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically...”
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  • 2
    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Descripción: “... of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically...”
    Guardado en:
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