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    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Description: “..., but with a higher dispersion rate (about five times). Nonetheless, both algorithms successfully optimised...”
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  • 2
    COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
    Description: “..., but with a higher dispersion rate (about five times). Nonetheless, both algorithms successfully optimised...”
    Saved in:
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